Surface Treatment Technologies

●Plating (Electrolytic and Electroless plating)

We are able to respond to a wide variety of needs with our plating technologies, such as Au plating for contact materials and contacts, environmentally-friendly lead-free solder plating, and electroless plating for metals.

We have also established an Au plating technology to plate large quantities of fine Ni-P particles having large specific surface area, which has been deemed difficult. We therefore offer technologies that are essential to improve the performance and density/integration of electronic components.

【Applications】

• ・Lead pins for MPU
• ・Lead pins for electronic components
• ・Hermetic sealant for packaging
• ・Power electronics modules
• ・Mounting materials for electronic components

Example

Please note that the products listed above are our typical products only. We supply customized products in many materials, shapes, sizes, and handle various plating processes. Please inquire us for more information.